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GDDR5 170 Ball EdgeProbe™ Interposers

GDDR5 170 BALL OSCILLOSCOPE EDGEPROBE INTERPOSER

EdgeProbe™ Technology

Nexus’ patented EdgeProbe™ designs require a small mechanical footprint by designing the probe points on the edge of the interposer. They are attached directly to the target. Read more…

Software

Oscilloscope de-embedding software filters/removes interposer effects. Please contact Nexus for the appropriate de-embedding software for your interposer.

Product Configuration Table

Nomenclature Data Width Interposer Type Quantity Included
NEX-GDDR5MCI170SCDSD x16/x32 Edgeprobe 1

If your application requires access to all signals probed and there is sufficient mechanical clearance, please view our GDDR5 170 Ball Oscilloscope Socketed Component Interposers.

Available Accessories

Type Desc. Quantity Nomenclature
Socket Memory socket 1 NEX-SOCKETGDDR5170
Solder Balls Install solder balls on interposer 1 NEX-OPT-SOLDERBALLS-EP
Solder Balls Install solder balls on socket 1 NEX-OPT-SOLDERBALLS-SK

Attachment Service

Nexus Technology’s expert attachment service provides a ready-to-go test solution customized to your application. We will attach the interposer and any additional accessories to your application’s target. We can also power-on and test your application to confirm functionality. Please contact us for more information.

Attachment Service
Attachment Service

Mechanical Outline

GDDR5 170 BALL OSCILLOSCOPE EDGEPROBE MECHANICAL
GDDR5 170 BALL OSCILLOSCOPE EDGEPROBE MECHANICAL

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Datasheets

  • GDDR5 170 Ball EdgeProbe™ Interposers Datasheet

Similar Products

  • GDDR5 170 Ball Oscilloscope Socketed Interposer
  • GDDR5 170 Ball Oscilloscope Direct Attach Interposer
  • GDDR5 Graphical Memory Interposers

Read More

  • EdgeProbe™ Interposer Technology
  • Electrical Analysis
  • The Nexus Difference

Family

This product / family is part of the electrical validation development cycle.
This product / family is part of the electrical validation development cycle.

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