Double-data rate fourth-generation (DDR4) main memory technologies are developed by the Joint Electronic Devices Engineering Council (JEDEC) for use in servers, workstations, and high-performance portable applications that require deep memory.
Nexus Technology offers high quality and high fidelity interposers, enabling the industry to confidently and accurately gain access to DDR4 main memory buses for debug and compliance verification. … more…
Packaging/Modules
DDR4 main memory is available in standard Ball-Grid-Array (BGA) component packages as well as dual-inline-memory-modules of DIMM and SODIMM. Standard BGA packages are soldered directly to the printed circuit board (PCB) while modules comprise a series of packages in a standard PCB format with standard connections between the DIMM and the main board. Interposers are available for both component packages and DIMM and SODIMM modules.
DIMM Interposers
| Module Type | MA41x0 Analyzer Interposer | MSO Interposer |
|---|---|---|
| DIMM | ✓ | ✓ |
| SODIMM | ✓ | ✓ |
Component Interposers
| Interposers | Options | |||||||
|---|---|---|---|---|---|---|---|---|
| Oscilloscope | MA Instrument | |||||||
| Package | Balls | EdgeProbe™ | Direct Attach | Target Socketed | Logic Compliance | Riser | Component Socket | |
| x4/x8 | 78 | ✓(XH) | ✓(XH) | ✓(XH) | ✓ | Yes | Yes | |
| x16 | 96 | ✓(XH) | ✓(XH) | ✓(XH) | ✓ | Yes | Yes | |
| x32 | 144 | ✓ | * | * | * | No | Yes | |
| Custom | Custom designs are also available. Please contact us. | |||||||
* If you don’t see what you need, please contact us for the most up to date information.
(XH) XH Series
XH Series
Nexus Technology’s XH Series interposers bring new enhancements to the EdgeProbe™ and Direct Attach types of memory component interposers that maintain signal integrity across the interposer path as well as provide for extremely high-fidelity oscilloscope probe points for both leading edge and emerging memory technologies.
Attachment Service
Nexus Technology’s expert attachment service provides a ready-to-go test solution customized to your application. We will attach the interposer and any additional accessories to your application’s target. We can also power-on and test your application to confirm functionality.
More Information on Interposer Types
Electrical Analysis
Electrical analysis is enabled by using either an EdgeProbe, High Density, or Socketed interposer to capture memory activity on an oscilloscope. The oscilloscope is then used to debug, analyze, and verify the analog characteristics of your design. Presenting an accurate representation of the signals under test to the oscilloscope is critical. Nexus interposers provide an unobtrusive interconnect and accurate signal to your oscilloscope. Learn more…
Logic / Compliance Analysis
Logic analysis is performed using a logic / compliance interposer to capture memory activity on a logic or memory analyzer. The logic or memory analyzer is then used to debug, analyze, and verify the logic (basic protocol) of your design. Compliance analysis uses the same interposers to capture activity on a memory analyzer. The memory analyzer is then used to debug, analyze, margin test, performance analyze, and verify the memory protocol. Learn more…
Product List
- DDR4 144 Ball EdgeProbe™ Interposers
- DDR4 78 Ball Logic/Compliance Interposer
- DDR4 78 Ball XH Series EdgeProbe Interposers
- DDR4 78 Ball XH Series Oscilloscope Direct Attach Interposer
- DDR4 78 Ball XH Series Oscilloscope Target Socketed Interposer
- DDR4 96 Ball Logic/Compliance Interposer
- DDR4 96 Ball XH Series EdgeProbe Interposers
- DDR4 96 Ball XH Series Oscilloscope Direct Attach Interposer
- DDR4 96 Ball XH Series Oscilloscope Target Socketed Interposer
- DDR4 DIMM Compliance Interposer
- DDR4 DIMM Mixed Signal Oscilloscope Interposer
- DDR4 SODIMM Compliance Interposer
- DDR4 SODIMM Mixed Signal Oscilloscope Interposer