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LPDDR3

EdgeProbe(TM) Interposers Solve Clearance Problems

March 21, 2017 By Nexus Technology, Inc.

Memory Component Interposer Installed on a DIMM
Memory Component Interposer Installed on a DIMM

If the Memory Fits, the Interposer Will Too

Nexus’ patented EdgeProbe(TM) interposers enable high-fidelity measurements and remove the concern for mechanical clearance on your target. Download paper…

Interposer installed with a riser under it to elevate it above surrounding passive components.
Interposer installed with a riser under it to elevate it above surrounding passive components.

Historically, interposers have been designed to be larger than the memory component they support. This forces the use of a socket or riser to elevate the interposer above passive components or another memory component on the target.

Nexus’ EdgeProbe(TM) technology enables our interposers to be virtually the same size as the memory component for easy probing with an oscilloscope.

 

Long wire shown to illustrate probe tip connection.
Long wire shown to illustrate probe tip connection.

EdgeProbe(TM) interposer installed on a DIMM.
EdgeProbe(TM) interposer installed on a DIMM.

Advantages of EdgeProbe(TM) Interposers

  • Small size
  • Excellent signal integrity
  • Robust interconnect to any oscilloscope probe
  • S-Parameter files for simulation and de-embedding filter file creation
  • Available for all memory technologies including: DDR4, DDR3, LPDDR4, LPDDR3, Flash, GDDR5, and custom designs.

Remember, an easy attachment service is also available so interposer installation is done for you!

Give us a call. We’re here to help.

Filed Under: Informational Tagged With: Custom Designs, DDR3, DDR4, EdgeProbe(TM), Flash, LPDDR3, LPDDR4

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