The XH Series interposers bring new enhancements to the EdgeProbe™ and Direct Attach types of memory component interposers that maintain signal integrity across the interposer path as well as provide for extremely high-fidelity oscilloscope probe points for both leading edge and emerging memory technologies.
New Oscilloscope Interposer – LPDDR5X 315-Ball
Fast, reliable access. Annoucing 8.5 GT/s oscilloscope interposer support for LPDDR5X and LPDDR5 315-ball BGAs.
- All major oscilloscope vendors supported
- 315-ball LPDDR5(X) 2×16 BGA Component
- JEDEC standard JESD209-5
- Easily access signals
- Embedded tip resistors
- Risers available
- S-Parameters for de-embedding and simulation
- Install with standard BGA rework
- Attachment & analysis services available
LPDDR5X Oscilloscope Interposer – 315-ball
XH Series
Leading edge technology includes oscilloscope tip resistors designed inside the interposer on all signals for speeds exceeding 8.5GT/s.
Easy Signal Access
Signals are brought out to pads for oscilloscope probing with multiple ground pads for easy signal monitoring.
Risers Available
Used to elevate the interposer above surrounding components, risers are installed along with the interposer using standard BGA reword practices.
Attachment & Testing Service
Attachment Service
For each interposer, the Attachment Service will install a component to the interposer and the interposer to the target. Other accessories may also be attached (risers, sockets, etc.).
Target Boot & Basic Functionality
For each target, this service will power on and ensure functionality of the target with the interposer(s) installed.
Add Digital Access
Add digital analysis using a PRB-FL probe and an MA51x0 series logic analyzer and real time protocol analysis instrument.
Learn More
Learn more about LPDDR5-315 Interposer
Learn more about our LPDDR5 Interposer Products
Learn more about our LPDDR5 Logic Analyzer / Protocol Analyzer
Contact Us: Click Here
Memory Analysis / JEDEC Compliance
Speed, power and size are driving the need for oscilloscopes with advanced probing solutions. High-fidelity interposers are required to make full use of the oscilloscope’s capabilities when working with JEDEC specification such as DDR4 (JESD79-4), LPDDR4 (JESD209-4), DDR5 (spec. in development) and LPDDR5 (spec. in development).
High Fidelity Interposers and Probing Services
Nexus Technology high-fidelity interposers are available in three different designs so that you can choose the best solution for your application. EdgeProbe(TM) interposers implement a patented design, enabling their fit on to any target. Socketed interposers implement another patented design that enable the user to quickly move the interposer from target to target without soldering; as well as enabling the user to install different memory on the interposer without soldering. Direct attach interposers reflect the traditional approach to interposer design and remain a popular alternative when mechanical clearance and/or re-usability/swapping is not of interest. Modern and emerging JEDEC standards create challenging test environments. Nexus Technology has advanced, high-fidelity interposer solutions and services ready for your challenges.
Signal fidelity is key to accurate acquisition and analysis using an oscilloscope. Our EdgeProbe(TM) interposers – as well as socketed interposers and direct attach interposers – are designed to exacting performance characteristics. Advanced probing using Nexus Technology high-fidelity interposers
- provide access to the signals you need;
- are easy to install yourself or as a service;
- fit anywhere w/patented EdgeProbe(TM) technology;
- provide fidelity you can see and measurements you can trust with always included s-parameters;
- and use exclusive patented designs.
You can see the signal fidelity of the interposer by comparing signals probed on the back-side of the component versus at the probe point of the interposer.
 |
 |
You can also see the signal fidelity of the interposer by inspecting the simulation results which show the insertion and return loss.
Attachment Service
Nexus Technology’s expert attachment service provides a ready-to-go test solution customized to your application. We will attach the interposer and any additional accessories to your application’s target. We can also power-on and test your application to confirm functionality.
You have made a significant investment in your oscilloscope and probes. Don’t let the last inch between the probe and your memory component impact that investment! Nexus’ patented interposer designs enable high fidelity measurements for accurate analysis.
Custom interposers are also available for unique applications. Contact us, we’re here to help!
LPDDR4 200 Ball Edge Probe Interposer for Use with Oscilloscopes
In Addition to our direct attach interposer for the LPDDR4 200 ball memory component we now offer a smaller edge probe version.
JEDEC Memory Compliance Testing Takes Step Forward
Nexus Technology reports that their DDR4 protocol analysis software and real-time memory analyzer supports JEDEC’s recently announced DDR4 Protocol Checks Engineering Procedure document JEP175.
“JEP175 is an important document that will help the industry standardize on protocol compliance and performance of memory systems. Representing a minimal but standardized set of procedures for the industry to follow, JEP175 is fully supported from day one with our real-time analyzer and protocol analysis software,” said Chris Shelsky, System Architect, Nexus Technology, Inc.
The DDR4 Protocol Checks Engineering Procedure document (JEP175) provides a concise accounting for many of the protocol checks that are necessary to confirm compliance to the DDR4 specification. These checks may also be measured and used for margin and performance analysis. Conforming to the latest specification of DDR4 (JESD79-4B released just last month), JEP175 is up to date with 55 unique checks.
Nexus’ real-time analyzer for DDR4 is the MA4100 and supports LRDIMM, R-DIMM, U-DIMM, SODIMM, and individual component bus monitoring. Similar to a logic analyzer and highly customized with real-time compliance and performance for DDR4, the MA4100 enables simultaneous compliance, performance and state capture of DDR4 traffic. This analyzer is required to validate compliance in real-world applications that is impossible to cover in verification simulations. The real-time analysis engine runs at-speed, processing up to 64Gbps to provide statistical insight and compliance validation as quickly as the data arrives. The real-time analysis engine is also coupled to the industry’s leading trigger and 1G-sample deep storage system. You can find more information on the MA4100 on our website.
Nexus’ DDR4 Protocol analysis software (PA-DDR4) enables memory interface functionality, timing and compliance analysis of simulated or post-capture DDR4 traffic. The software implements the same analysis package found in the MA4100 analyzer. This enables identical protocol checks during both verification and validation while also providing the same user experience and an easy transition from verification using industry standard VIP simulation packages to real-world validation using the MA4100 analyzer.
Having the same analysis packages and protocol checks performed during verification and validation, using the DDR4 protocol analysis software (PA-DDR4) and MA4100 analyzer, respectively, helps identify real design issues earlier and faster. This allows faster time-to-market for products implementing DDR4 memory. The core tools necessary to test, verify and validate any DDR4 design are: an industry standard simulation tool with a DDR4 controller model and memory model, Nexus’ NEX-PA-DDR4 software package, Nexus’ MA4100 analyzer and a high-speed oscilloscope.
Industry’s First LPDDR2 134-Ball Memory Interposer for Oscilloscopes
New: 134-Ball LPDDR2 Memory Component Interposer
Nexus interposers provide superior analog visibility for use with an oscilloscope. All signals are brought out to probe points that are designed to accommodate solder down probe tips.
Support for 134-Ball LPDDR2 Memory Device
- 10.0mm x 11.5mm pitch
- x16/x32 discrete package
- Simulation model and SDE model included
Custom Designs Can Be Made For
- All memory technologies
- All form factors
- Component
- Slot
- DIMM
- SODIMM
- All Instruments
- Oscilloscope
- Logic Analyzer
- Memory Analyzer
Contact us for more information.